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Michael Bronstein


Michael Bronstein is an associate professor of Informatics at USI Lugano in Switzerland, associate professor of Applied Mathematics at Tel Aviv University in Israel, and a Principal Engineer at the Intel Perceptual Computing group. Michael got his Ph.D. with distinction in Computer Science from the Technion in 2007. He has previously held visiting appointments at Politecnico di Milano, Stanford, INRIA, Technion, and University of Verona. He is a Senior Member of the IEEE, alumnus of the Technion Excellence Program and the Academy of Achievement, ACM Distinguished Speaker, and a member of the Young Academy of Europe. His research appeared in the international media such as CNN and was recognized by numerous prestigious awards, including several best paper awards, the Hershel Rich Innovation Award (2003), three ERC grants (Starting Grant 2012, Proof of Concept Grant 2016, and Consolidator Grant 2016), Google Faculty Research Award (2016), Radcliffe Fellowship from the Institute for Advanced Study at Harvard University (2017), and Rudolf Diesel Industrial Fellowship from TU Munich (2017). In 2014, he was invited as a Young Scientist to the World Economic Forum, an honor bestowed on forty world's leading scientists under the age of forty. He was a guest speaker at the World Economic Forum meeting in Dalian, China in 2015. Michael is the author of the first book on deformable 3D shape analysis, editor of four books, more than 100 papers in top scientific journals and conferences, and inventor of 25 granted patents. He has chaired more than a dozen of conferences and workshops in his field, and has served as area chair at ECCV 2016 and ICCV 2017 and as associate editor of the Computer Vision and Image Understanding journal. He has given over 70 invited and keynote talks during his career. Besides academic work, Michael is actively involved in the industry. He has co-founded and served in leading technical and management positions at several startup companies, including Invision, an Israeli startup developing 3D sensing technology acquired by Intel in 2012. This technology can now be found in new generation of computers from all the major brands. 


Our research focuses on mathematical models for large-scale and complex data analysis, and applications in the domains of machine learning, computer vision, computer graphics, and geometric processing. 

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